Up to CAD 187 Million Allocated for Bromont Chip Plant Expansion
IBM, Canada, and Quebec will collectively invest CAD 187 million ($139.6 million) to enhance assembly, testing, and packaging capabilities at IBM’s semiconductor manufacturing facility in Bromont, QC. This expansion aims to bolster the production of semiconductor modules used in a myriad of applications, including telecommunications, high-performance computing, automotive, aerospace and defense, computer networks, and generative AI.
Strengthening Innovation and Job Creation
Prime Minister Justin Trudeau highlighted the significance of this investment, stating, “Today’s announcement is a massive win for Canada and our dynamic tech sector. It will create high-paying jobs, invest in innovation, strengthen supply chains, and help make sure the most advanced technologies are Canadian-made. Semiconductors power the world, and we’re putting Canada at the forefront of that opportunity.”
Advancing Semiconductor Ecosystem and Research
In addition to the expansion, IBM will focus on researching and developing scalable manufacturing methods and advanced assembly processes. These efforts aim to support diverse chip technologies and reinforce Canada’s position in the North American semiconductor supply chain. The initiative also promotes collaboration with small and medium-sized Canadian enterprises, fostering a robust semiconductor ecosystem for the future.
IBM’s Bromont plant, a key player in North America’s chip assembly and testing landscape for 52 years, continues to transform advanced semiconductor components into cutting-edge microelectronic devices. As chip packaging becomes increasingly complex with miniaturized electronic devices, advances in packaging technologies are critical. IBM’s introduction of the world’s first 2-nanometer chip technology in 2021 underscores the growing importance of such innovations.
