U.S. Government to Bolster Semiconductor R&D with New Funding Opportunities
The Biden-Harris Administration has unveiled plans to invest up to $1.6 billion to expand and accelerate domestic capabilities in advanced semiconductor packaging. As part of President Biden’s “Investing in America” initiative, the U.S. Department of Commerce has issued a Notice of Intent (NOI) to initiate a competition for research and development (R&D) efforts aimed at advancing semiconductor technologies. This initiative, led by the CHIPS for America program, will target five key R&D areas with the goal of driving innovation and strengthening the National Advanced Packaging Manufacturing Program (NAPMP). Several awards, amounting to approximately $150 million each, will be available to support cooperative agreements between the government, private sector, and academia.
Creating a Competitive U.S. Semiconductor Ecosystem
U.S. Secretary of Commerce Gina Raimondo emphasized the significance of advanced packaging in the domestic semiconductor industry, highlighting its role in enhancing national competitiveness. “President Biden has made it clear that the U.S. must build a thriving semiconductor ecosystem, with advanced packaging as a critical component,” said Raimondo. “This investment will not only create high-quality jobs but also position the U.S. as a leader in cutting-edge semiconductor technologies.”
The demand for advanced packaging is growing rapidly, driven by emerging technologies like artificial intelligence (AI) and high-performance computing. These technologies require breakthroughs in microelectronics, with advanced packaging playing a crucial role in improving system performance, reducing costs, and enhancing energy efficiency.
Innovating for the Future of Semiconductor Manufacturing
Under Secretary of Commerce for Standards and Technology and Director of the National Institute of Standards and Technology (NIST) Laurie E. Locascio outlined the long-term vision for the National Advanced Packaging Manufacturing Program. “With the support of CHIPS for America, we aim to establish a domestic advanced packaging industry within the next decade. This program will enable the U.S. to lead the world in semiconductor innovation,” said Locascio.
The investment will focus on five critical R&D areas: equipment and process integration, power delivery and thermal management, connector technologies, the chiplets ecosystem, and co-design/electronic design automation (EDA). These advancements will support the development of prototypes, further solidifying the U.S. as a global leader in semiconductor manufacturing.
Assistant to the President for Science and Technology, Arati Prabhakar, added, “This is a pivotal moment for semiconductor manufacturing in the U.S. With this investment, we are securing the future of this rapidly evolving industry and ensuring it thrives here at home.
